Intel najavio 'Coffee Lake' + AMD 'Vega' module s više čipova



Rumors of the unthinkable silicon collaboration between Intel and AMD are true, as Intel announced its first multi-chip module (MCM), which combines a 14 nm Core 'Coffee Lake-H' CPU die, with a specialized 14 nm GPU die by AMD, based on the 'Vega' architecture. This GPU die has its own HBM2 memory stack over a 1024-bit wide memory bus. Unlike on the AMD 'Vega 10' and 'Fiji' MCMs, in which a silicon interposer is used to connect the GPU die to the memory stacks, Intel deployed the Embedded Multi-Die Interconnect Bridge (EMIB), a high-density substrate-level wiring. The CPU and GPU dies talk to each other over PCI-Express gen 3.0, wired through the package substrate.

Ovaj modul s više čipova, s malom visinom Z, značajno smanjuje otisak ploče CPU + diskretne grafičke implementacije, u usporedbi s odvojenim CPU i GPU paketima s GPU-om koji ima diskretne GDDR memorijske čipove, i omogućava novu vrstu ultra prijenosna prijenosna računala koja spajaju čvrst grafički mišić. MCM bi trebao omogućiti uređaje tanke 11 mm. Specifikacije CPU-a i dGPU matrica ostaju ispod okvira. Prvi uređaji s ovim MCM-om pokrenut će se u prvom tromjesečju 2018. godine. Slijedi video prezentacija.