SK Hynix najavio svoje HBM2E memorijske proizvode, 460 GB / s i 16 GB po stoku
SK Hynix Inc. announced today that it has developed HBM2E DRAM product with the industry's highest bandwidth. The new HBM2E boasts approximately 50% higher bandwidth and 100% additional capacity compared to the previous HBM2. SK Hynix's HBM2E supports over 460 GB (Gigabyte) per second bandwidth based on the 3.6 Gbps (gigabits-per-second) speed performance per pin with 1,024 data I/Os (Inputs/Outputs). Through utilization of the TSV (Through Silicon Via) technology, a maximum of eight 16-gigabit chips are vertically stacked, forming a single, dense package of 16 GB data capacity.
SK Hynix-ov HBM2E optimalno je rješenje za memoriju četvrte industrijske ere, a podržava vrhunski GPU, superračunala, strojno učenje i sustave umjetne inteligencije koji zahtijevaju maksimalnu razinu memorijskih performansi. Za razliku od robnih DRAM proizvoda koji prihvaćaju obrasce paketa modula i montiraju se na sistemske ploče, HBM čip je usko povezan s procesorima poput GPU-a i logičkih čipova, udaljen je samo nekoliko µm jedinica, što omogućava još brži prijenos podataka.
'SK Hynix has established its technological leadership since its world's first HBM release in 2013,' said Jun-Hyun Chun, Head of HBM Business Strategy. 'SK Hynix will begin mass production in 2020, when the HBM2E market is expected to open up, and continue to strengthen its leadership in the premium DRAM market.'
SK Hynix-ov HBM2E optimalno je rješenje za memoriju četvrte industrijske ere, a podržava vrhunski GPU, superračunala, strojno učenje i sustave umjetne inteligencije koji zahtijevaju maksimalnu razinu memorijskih performansi. Za razliku od robnih DRAM proizvoda koji prihvaćaju obrasce paketa modula i montiraju se na sistemske ploče, HBM čip je usko povezan s procesorima poput GPU-a i logičkih čipova, udaljen je samo nekoliko µm jedinica, što omogućava još brži prijenos podataka.
'SK Hynix has established its technological leadership since its world's first HBM release in 2013,' said Jun-Hyun Chun, Head of HBM Business Strategy. 'SK Hynix will begin mass production in 2020, when the HBM2E market is expected to open up, and continue to strengthen its leadership in the premium DRAM market.'